Technical Features
CPU | 3rd Gen Intel® Xeon® Scalable Processors |
---|---|
Chipset | |
RAM | 16 DDR4 3200MHz RDIMM, up to 512GB |
LAN | 2 x 1G LAN by Intel® I210; 1 x 1G LAN supports OOB (by optional BMC Module) |
I/O | 2 x USB3.2 Type-A; 1 x RJ45 Console; 1 x USB Type-C Console |
Storage | 4 x Front-access 2.5″ SSD/HDD Tray (SATA III (6Gbps)), hot swappable, support S/W RAID 0, 1, 5, 10; 2 Front-access U.2 SSD Tray (PCIe x4/each); 2 Internal M.2 Key M Socket (2280, PCIe x4) |
Expansion | 2 x PCIe x16 Slot with 2 PCIe 4.0 x16 signal; 2 x PCIe x16 Slot with 2 PCIe 4.0 x8 Signal |
Operative range | 0°C ÷ 40°C |
Power | RMS-4000 : DC 40V to 72V, CRPS Redundant Power Supply, supports 1200W RMS-4000A: AC 90V to 264V, CRPS Redundant Power Supply, supports 2000W |
Notes | CE, FCC |
TPole s.r.l. - REA 330560 - P.IVA 02978370183 - PEC: tpole@pec.tpole.it - Cap. Sociale: € 50.000,00 | Credits