Category : News by T-Pole | 24 October 2017
We present some products that can be equipped with Kaby Lake S Intel® i Core™ processor.
We note that since Intel® has not defined any embedded chipset of the Kaby Lake series, the chipsets used are from the Skylake. series.
Mini PC Fanless ECS-9000-4G
The first product, a Vecow fanless mini PC, is the ECS-9000-4G model.
The commercial success of the Ivy Bridge version (3rd Generation Intel® Core ™) has pushed the manufacturer to produce the same model with the new platform.
The 4 ethernet ports are the predominant feature of this PC and make it suitable for interfacing applications with Gigabit ethernet cameras; such as video surveillance and qualitiy control.
On the fanless mini PC ECS-9000-4G, which has the C236 chipset, you can mount Xeon and Intel® i Core ™ processors with different tdp.
We start with 80W of XEON processors (E3-1275 v5, E3-1225 v5), 65W of Intel® i Core ™ processors, and we get to the 35W series of Intel Core and Xeon E3-1268L v5 processors.
This data has an important impact on the operating temperature of the PC:
- -40 ° C to 45 ° C with TDP 80W processors (Xeon® E3-1275 v6, E3-1275 v5, E3-1225 v5)
- -40 ° C to 55 ° C with TDP 65W processors
- -40 ° C to 70 ° C with TDP 35W processors
TPole provides specialized support in the CPU sizing phase, in order to provide the best solution in terms of performance, consumption and price.
Here are the main features of the product.
- LGA 1151 Socket supports workstation-grade
- Intel® Xeon®/Core™ i7/i5/i3 Processor with C236.
- Fanless, -40°C to 75°C Operating Temperature
- 4 Independent GigE LAN.
- SIM Sockets for 3G/4G/LTE/WiFi/GPRS/UMTS
- 3xMini PCIe slots
- 3SIM card socktet
- M2DOM supports up to 8GT/s data rate
- 6V to 36V DC-in, 80V Surge Protection
- Configurable Ignition Power Control
Download the mini fanless ECS-9000-4G fan board
ATX Kaby Lake Board
The second product is the ATX SD631-Q170 card, which can also be equipped with Kaby Lake processors. The board is equipped with the Q170 chipset, the most varied version of Skylake family features. Unlike the C236 model, Xeon series processors can not be used.
The main differences with H110 version are:
- DIMMs per channel, 2 for the Q170 and 1 for H110.
- Display stand: 3 for Q170 and 2 for H110
- Maximum number of PCIe lines: 20 (3rd Generation) for Q170 and 6 (2nd Generation) for H110
- Maximum USB number: 24 for the Q170, 14 for H110
- RAID: Q170 supports raid modes 0.1.5.10 while H110 does not support any of these
The model proposed is SD631-Q170, this board can be equipped with processors of 6th and 7th Generation.
This card is characterized by its high expandability, we find:
- 2xSlot PCIe x16 (1xPCIe x16 or 2xPCIe x8)
- 2xPCIe x4
- 3xPCI
We also have:
- 6 COMs of which 2 are configurable in RS232 / 422/485
- 2xLANs with Intel chipset
- 14 USB 6xUSB 3.0 + 8xUSB 2.0
The main differences with the H110 version are:
DIMMs per channel, 2 for the Q170 and 1 for H110.
Display stand: 3 for Q170 and 2 for H110
Maximum number of PCIe lines: 20 (3rd Generation) for Q170 and 6 (2nd Generation) for H110
Maximum USB number: 24 for the Q170, 14 for H110
RAID: Q170 supports raid modes 0.1.5.10 while H110 does not support any of these
The proposed model is SD631-Q170, this card can be equipped with 6th and 7th Generation processors.
This card is characterized by its high expandability, we find:
- 2xSlot PCIe x16 (1xPCIe x16 or 2xPCIe x8)
- 2xPCIe x4
- 3xPCI
We also have:
- 6 COMs of which 2 are configurable in RS232 / 422/485
- 2xLANs with Intel chipset
- 14 USB 6xUSB 3.0 + 8xUSB 2.0